VS/NS Serie
Lead-Free Hot Air Reflow Ovens
Features
  • VS standard with KIC 24-7 to get Real-Time process monitoring, SPC charting, Thermal analyze and monitoring records is traceable.
  • Newly designed high-efficient air management system and lengthened effective heating zones, which transfer the convective heat to PCB assembly more uniformly, thoroughly & efficiency.
  • Temperature controls independently & adjustable air velocity to meet high-precision Lead-Free Soldering requirements.
  • Minimized the temperature difference between large and small components effectively; eliminated the risk of thermal damage to components for ensure the reliability of solder joint.
  • Step forced cooling system to easily achieve the requirements of strict Lead-Free Soldering processing.
  • Stabilization and reliability of repetitive precision is advanced with PLC+ Modularize Control System.
  • The Dual Thermal Sensor & Safety Controlling System would be protects the PCBs not burn out when abnormity occurred.
  • The mainly parts is come from the original of famous foreign brand, be guarantee the functioning and durability of each machine.
  • Windows XP adapted to abundant operating interface, the Chinese and English onscreen alternative is available.
  • Prepared the Auto-diagnosis function to checking, showing and records a lot of fault.
VS-800-N Lead-Free Hot Air Reflow Oven's Profile

Identical temperature setting of Top and Bottom chamber of each zone ( Unit = ¡æ)

Zone1 Zone2 Zone3 Zone4 Zone5 Zone6 Zone7 Zone8
135 145 180 185 185 195 255 253

Conveyor Speed£º90mm/min.
 
Explanation of profiling
A:Temperature difference between Setting and PCB's Peak Temperature.

B: The length ( = Timing) of heating zone.

C:The effective length ( = Timing) of heating zone above.

1)If "A" is getting smaller, the precision of temperature control becomes more accurate.
2)C¡ÂB = D(%) ; This is the proportion of the effective heat length within the heating area. When "D" is closer to 100%, PCB will be able to absorb more heat.

Advantage : The newly designed VS series Nitrogen / Air Reflow Ovens adopts a unique air management configuration, that significantly improved the efficiency of thermal conduction while achieving uniform temperature in the heating zones.
Even for components with different thermal capacity on big size PCB assemblies, a minimizing¨ST can also be achieved to obtain the best soldering results.